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Physical Dimensions
8
5.00
4.80
3.81
5
A
B
0.65
6.20
5.80
4.00
3.80
1.75
5.60
PIN ONE
INDICATOR
(0.33)
1
4
1.27
0.25
M
C B A
1.27
LAND PATTERN RECOMMENDATION
1.75 MAX
0.25
0.10
C
SEE DETAIL A
0.25
0.19
0.51
0.50 x 45°
0.25
R0.10
R0.10
8°
0°
0.90
0.406
0.10 C
0.33
GAGE PLANE
0.36
SEATING PLANE
(1.04)
DETAIL A
SCALE: 2:1
OPTION A - BEVEL EDGE
OPTION B - NO BEVEL EDGE
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
Figure 12. 8-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor ’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
8
www.fairchildsemi.com
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